Cooler Master Thermal Compound

Cooler Master Thermal Compound

Item#:  8381368  | Model#: HTK-002-U1

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Cooler Master Thermal Compound Product Details

Thermal Paste

Cooler Master Thermal Compound
The Cooler Master Thermal Compound is a supreme thermal compound that includes high thermal conductivity with low thermal resistance. It is used to increase surface contact area for heat transfer by minimizing any air bubbles that exists on the base of the heat sink. Designed with silicone materials and heat conductive metal oxides, this thermal compound is an ultimate solution for your CPU, chipsets on Mainboard, VGA card, etc. The product has Zif Socket Templates that show you in which area you have to apply, with many CPU socket types. Also, it can maintain a positive heat sink seal by withstanding changes in consistency level, at up to 177 C (350 F) temperature. Pick your Cooler Master Thermal Compound today!

  • Manufactured by: Cooler Master
    Warranty provided by: Cooler Master
    UPC No: 836837001053
    Mfg Part No: HTK-002-U1
  • Box Size: ( Length:7, Width:4, Depth:1)
    Shipping Weight: 0.0000 pound(s)
    Click here for full warranty and support information
  • Cooler Master logos are registered trademarks of Cooler Master. All others trademarks and copyrights mentioned herein are the property of their respective owners.