Cooler Master Thermal Compound Product Details
Cooler Master Thermal Compound
The Cooler Master Thermal Compound is a supreme thermal compound that includes high thermal conductivity with low thermal resistance. It is used to increase surface contact area for heat transfer by minimizing any air bubbles that exists on the base of the heat sink. Designed with silicone materials and heat conductive metal oxides, this thermal compound is an ultimate solution for your CPU, chipsets on Mainboard, VGA card, etc. The product has Zif Socket Templates that show you in which area you have to apply, with many CPU socket types. Also, it can maintain a positive heat sink seal by withstanding changes in consistency level, at up to 177 C (350 F) temperature. Pick your Cooler Master Thermal Compound today!
Manufactured by: Cooler Master
Warranty provided by: Cooler Master
UPC No: 0836837001053
Mfg Part No: HTK-002-U1
( Length:7, Width:4, Depth:1)
Shipping Weight: 0.1000 pound(s)
Dimensional Weight: 1pounds
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