Cooler Master Thermal Compound Product Details
Cooler Master Thermal Compound
The Cooler Master Thermal Compound is a supreme thermal compound that includes high thermal conductivity with low thermal resistance. It is used to increase surface contact area for heat transfer by minimizing any air bubbles that exists on the base of the heat sink. Designed with silicone materials and heat conductive metal oxides, this thermal compound is an ultimate solution for your CPU, chipsets on Mainboard, VGA card, etc. The product has Zif Socket Templates that show you in which area you have to apply, with many CPU socket types. Also, it can maintain a positive heat sink seal by withstanding changes in consistency level, at up to 177 C (350 F) temperature. Pick your Cooler Master Thermal Compound today!
Manufactured by: Cooler Master
Warranty provided by: Cooler Master
Limited Warranty: 12 months parts; 12 months labor
Mfg Part No: HTK-002-U1
UPC No: 836837001053
Box Size: ( Length:7, Width:4, Depth:1)
Shipping Weight: 0.2500 pound(s)
Dimensional Weight: 1pounds
What is Dimensional weight?
Click here for full warranty and support information
- Limited Warranty: A full text version of the limited warranty
may be obtained by mailing a self addressed, stamped envelope to the
address below and requesting the warranty for item number: C283-1147
7795 W. Flagler St. Suite 35
Miami, FL. 33144
- Cooler Master logos are registered trademarks of Cooler Master. All others trademarks and copyrights mentioned herein are the property of their respective owners.